Radiation curable resin composition for cast polymerization

Abstract

A radiation curable resin composition capable of producing molded articles which have excellent transparency, small light-coloring resistance, high dimensional accuracy, high surface hardness, and high thermal resistance. The radiation curable resin composition for cast polymerization, comprises (A) a (meth)acryloyl group-containing compound represented by the following general formula (1): wherein R1 represents a hydrogen atom or a methyl group, R2 represents an alkylene group or a hydroxyalkylene group having 2-6 carbon atoms, R3 represents a divalent organic group, n denotes an integer from 0 to 6, m denotes an integer from 1 to 10, and L denotes an integer from 0 or 1; (B) a (meth)acryloyl group-containing compound represented by the following general formula (2): wherein R4 represents a hydrogen atom or a methyl group, R5 represents an alkylene group having 2-6 carbon atoms, and p denotes an integer from 1 to 16; and (C) a radiation active initiator possessing a specific molar absorption coefficient, respectively in a specific amount.

Dependencies are inferred from the claim text.