Method of cutting and separating a bent board into individual small divisions
AssigneeDisco Corporation
InventorsMasahiro Yoshii, Shinichi Namioka
Life of this patent
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Abstract
Disclosed is an improved method of cutting and separating a bent board into individual small divisions. Prior to the cutting and separating of the board into the individual chips the board is cut and separated into two or more pieces each large enough to have a reduced bend, compared with the bend of the board. Thus, each large division can be put and fixedly held on the chuck table of a cutting machine in stable condition, thus permitting the smooth, stable cutting of the large division into final small divisions.
Claims6
A method of cutting and separating a bent board into individual small divisions with the aid of a cutting machine including at least a chuck table for holding a workpiece and means for cutting the workpiece held on the chuck table comprising the steps of:
- cutting and separating the board into two or more large divisions each large division having a reduced bend, compared with the bend of the board, allowing said large division to be closely spaced and sucked onto the chuck table;
- and
- then cutting and separating the board into the individual small divisions.
Dependencies are inferred from the claim text.