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US 6,285,562 B1Granted
Method of contacting a chip
AssigneeFraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V.
InventorsElke Zakel, Joachim Eldring
Life of this patent
Estimating the term…
Abstract
In a chip bonding method, first bonding bumps are applied to bonding electrodes of the chip, a first flexible circuit carrier is arranged on the chip, the flexible circuit carrier having cavities which are aligned with the bonding bumps, and second bonding bumps are applied to the first bonding bumps in such a way that bonding areas on the first flexible circuit carrier are in contact with the first and/or second bonding bumps.
Claims13
A method for mounting a chip on a flexible circuit carrier, comprising the method steps of:
- a) applying first bonding bumps to bonding electrodes of the chip;
- b) arranging a first flexible circuit carrier, provided with at least one bonding area, on the chip, the flexible circuit carrier having cavities which are aligned with the bonding bumps and which extend through the first flexible circuit carrier and at least one bonding area on the first flexible circuit carrier;
- and
- c) after step b), applying second bonding bumps to the first bonding bumps such that at least one bonding area on the first flexible circuit carrier is in contact with at least one of the first or second bonding bumps.
1 more element
Dependencies are inferred from the claim text.