Method for increasing device reliability by selectively depopulating solder balls from a foot print of a ball grid array (BGA) package, and device so modified

A device, comprising:

• a semiconductor die;
• and
• a substrate, a first side of said substrate coupled to said die and a second side of said substrate having a selectively depopulated ball grid array in which multiple traces or lines coupling solder ball pads to said first side of said substrate are routed through space that is vacated as a result of the depopulation of solder balls and respective solder ball pads, vias and traces or lines, said substrate providing improved device reliability through a reduction in ball joint fatigue.

A method for improving reliability of a ball grid array (BGA) package in which increased diameter vias are provided on the foot print of said package to reduce ball joint fatigue and multiple traces or lines are routed through space that is vacated as a result of selective depopulation of solder balls and their respective solder ball pads, vias and traces or lines from said foot print.

A method for improving reliability of a ball grid array (BGA) package wherein multiple traces or lines are routed through space that is vacated as a result of selective depopulation of solder balls and their respective solder ball pads, vias and traces or lines from a substrate of said package, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is practical without said selective depopulation and trace or line routing.

A method for improving reliability of a ball grid array (BGA) package wherein multiple traces or lines are routed through space that is vacated as a result of selective depopulation of solder balls and their respective solder ball pads, vias and traces or lines from a substrate of said package, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is permitted by optimum line/space design rules without said selective depopulation and trace or line routing.

A method for improving reliability of a ball grid array (BGA) package by reducing ball joint fatigue, wherein multiple traces or lines are routed through space that is vacated as a result of selective depopulation of solder balls and their respective solder ball pads, vias and traces or lines from a substrate of said package, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is practical without said selective depopulation and trace or line routing.

A method for improving reliability of a ball grid array (BGA) package by reducing ball joint fatigue, wherein multiple traces or lines are routed through space that is vacated as a result of selective depopulation of solder balls and their respective solder ball pads, vias and traces or lines from a substrate of said package, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is permitted by optimum line/space design rules without said selective depopulation and trace or line routing.

A device, comprising:

• a semiconductor die;
• and
• a substrate, a first side of said substrate coupled to said die and a second side of said substrate and a selectively depopulated ball grid array in which multiple traces or lines coupling solder ball pads to said first side of said substrate are routed through space that is vacated as a result of the depopulation of solder balls and respective solder ball pads, vias and traces or lines, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is practical without said selective depopulation and trace or line routing.

A device, comprising:

• a semiconductor die;
• and
• a substrate, a first side of said substrate coupled to said die and a second side of said substrate and a selectively depopulated ball grid array in which multiple traces or lines coupling solder ball pads to said first side of said substrate are routed through space that is vacated as a result of the depopulation of solder balls and respective solder ball pads, vias and traces or lines, said selective depopulation and trace or line routing facilitating use of larger diameter vias than is permitted by line/space design rules without said selective depopulation and trace or line routing.