US 6,285,559 B1 · Multichip module

Abstract

A multichip module (MCM) of the present invention includes a first substrate formed with through holes and having shield electrodes arranged therein. At least one semiconductor device is mounted on one major surface of the first substrate and electrically and mechanically connected to the first substrate by a first conductive material. A second substrate is mounted on the other major surface of the first substrate and formed with through holes. At least one filter device is mounted on the other major surface of the first substrate and electrically and mechanically connected to the first substrate by a second conductive material. The second substrate is electrically connected to the semiconductor device by the through holes and first conductive material. The MCM is capable of enhancing the efficient mounting of devices and promoting easy insulation between the devices.

Claims21

Dependent claims

A multichip module comprising:

a first substrate formed with through holes and having shield electrodes arranged therein;
at least one semiconductor device mounted on one of opposite major surfaces of said first substrate and electrically and mechanically connected to said first substrate by a first conductive material;
a second substrate formed with through holes;
and
at least one filter device mounted on the other major surface of said first substrate and electrically and mechanically connected to said first substrate by a second conductive material;
and
said second substrate being mounted on said other major surface of said first substrate and electrically connected to said semiconductor device by said through holes and said first conductive material.

4 more elements

Dependencies are inferred from the claim text.

Multichip module

Life of this patent

Multichip module

Life of this patent

Abstract

Claims21