Microprocessor subsystem module for PCB bottom-side BGA installation
AssigneeIntelect Communications, Inc.
InventorsRobert H. Frantz, Ramon E. Helms
Life of this patent
Estimating the term…
Abstract
The inventive embedded processing subsystem module is adapted for backside circuit board assembly directly opposite of a specific microprocessor or Digital Signal Processor so that circuit groups such as memory banks and communications peripherals may utilize otherwise unused backside printed circuit board space underneath the processor device, and further so that high-speed signals interconnecting the processor and subsystem circuit devices traverse a minimized printed circuit track length.
Claims7
An embedded processing subsystem module suitable for installation to a printed circuit board on a surface opposing a microprocessor, said microprocessor having a 2-dimensional grid array signal pinout wherein signal connections are arranged in columns and rows, said module comprising:
- a printed circuit board having a top surface with electronic components of a microprocessing subsystem mounted thereupon, and bottom surface;
- a ball grid array printed circuit pattern having a plurality of soldering pads for solder balls, said ball grid array pattern being disposed on said printed circuit board bottom surface, said ball grid array pattern having a one-dimensional transposed signal pinout equivalent to said microprocessor 2-dimensional signal pinout transposed in either a row or a column dimension but not transposed in both dimensions;
- and
- a plurality of solder balls disposed on said soldering pads of the ball grid array pattern thereby forming a subsystem module in which said subsystem module is adapted to directly electrically interconnect with the microprocessor.
Dependencies are inferred from the claim text.