Method and an arrangement for the electrical contact of components
AssigneeTelefonaktiebolaget LM Ericsson (publ)
InventorDavid Westberg
Life of this patent
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Abstract
A method and an arrangement for connecting a component, such as a chip (6), on a substrate (7) to a conductive surface of a carrier. The conductive surface can be an earth plane (10) and the carrier can be a printed circuit board. The method and arrangement allow the component to thermally conduct and/or electrically conduct onto the conductive surface.
Claims18
A method of improving the thermal and/or electrical properties of a chip connected to a substrate mounted on a printed circuit board, comprising the step of:
- connecting the chip to a conductive surface on the printed circuit board by a conductive layer between the chip and the conductive surface on the printed circuit board.
An arrangement for improving the thermal and/or electrical properties of a chip, the arrangement comprising:
- the chip connected to a substrate mounted on a printed circuit board, wherein a conductive layer is provided between the chip and the printed circuit board for contact of the chip with a conductive surface on the printed circuit board.
An arrangement comprising:
- a chip;
- a substrate, wherein the chip is connected to the substrate;
- a printed circuit board, wherein the chip is arranged to be placed directly above a conductive surface of the printed circuit board, and the chip is connected to the conductive surface.
An arrangement comprising:
- a component;
- a substrate, wherein the component is connected to the substrate;
- a printed circuit board, wherein the component is arranged to be in directly above an electrically and thermally conductive surface of the printed circuit board, and the component is connected to the conductive surface.
Dependencies are inferred from the claim text.