Ultra-small resistor-capacitor thin film network for inverted mounting to a surface

A miniature array device for inverted mounting to a surface, said device comprising:

• a substrate having predetermined width and length dimensions;
• a plurality of thin film RC circuits located on said substrate, each of said RC circuits including:
• (a) a first conductive pattern disposed on said substrate, said first conductive pattern defining at least one first capacitor plate;
• (b) a dielectric layer disposed on said at least one first capacitor plate having a dielectric constant of at least 100;
• (c) a second conductive pattern defining at least one second capacitor plate, said at least one second capacitor plate being situated in relation to said at least one first capacitor plate so as to form a capacitor;
• (d) a thin film resistor electrically connected to said at least one second capacitor plate;
• and
• (e) terminal conductors defining terminal pads of said RC circuits.

A miniature array device for inverted mounting to a surface, said device comprising:

• a silicon substrate having predetermined width and length dimensions;
• a plurality of thin film RC circuits located on said substrate, each of said RC circuits including:
• (a) a first conductive pattern disposed on said substrate, said first conductive pattern defining at least one first capacitor plate;
• (b) a dielectric layer juxtaposed to said at least one first capacitor plate and having a dielectric constant of at least 100;
• (c) a patterned combination having a conductive layer contiguous to a resistor layer, part of said patterned combination defining at least one second capacitor plate situated in relation to said at least one first capacitor plate so as to form a capacitor;
• (d) said conductive layer being removed from said resistor layer in a portion of said combination to provide a predetermined resistor value;
• and
• (e) wherein said patterned combination further defines terminal pads of said RC circuits.

A method of manufacturing a thin film array device comprising a plurality of RC circuits, said method comprising the steps of:

• (a) providing a generally planar substrate having predetermined length and width dimensions;
• (b) applying a first conductive layer to said substrate, said first conductive layer formed so as to define a plurality of first capacitor plates;
• (c) applying a dielectric layer having a dielectric constant of at least 100 to cover said first capacitor plates of said first conductive layer;
• (d) applying a second conductive layer defining a plurality of second capacitor plates opposed to respective of said first capacitor plates to produce respective capacitor devices and further defining terminal pads of said RC circuits;
• (e) forming a plurality of thin film resistors, at least one of said resistors being associated with each of said capacitor devices and being electrically connected thereto;
• and
• (f) applying an encapsulate over said layers on said substrate.