Mark detection method, optical system and mark position detector
AssigneeNikon Corporation
InventorNaomasa Shiraishi
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AssigneeNikon Corporation
InventorNaomasa Shiraishi
Estimating the term…
A position detection method detects the position of a mark formed at the bottom of a film such as a polysilicon layer which transmits no visible light. A flattened alignment mark is formed on a wafer, onto which the pattern on a reticle is transferred. A polysilicon film is formed on the alignment mark. An alignment sensor includes a laser light source and a frequency shifter, which produce light beams having wavelengths between 800 and 1500 nm and differing slightly in frequency from each other. The beams are radiated through a projection optical system and transmitted by the polysilicon film to irradiate the alignment mark. The diffracted light from the alignment mark is received through the optical system by a photoelectric detector. On the basis of the signal detected by the photoelectric detector, the position of the alignment mark is detected.
A mark detection method for detecting an alignment mark having a recess in which an insulator is embedded formed on a substrate, the alignment mark being covered with a film which transmits no visible light comprising:
A mark detector which detects an alignment mark formed on a substrate, the alignment mark having a recess in which an insulator is embedded and being covered with a film which transmits substantially no visible light comprising:
A method of producing an exposure apparatus which exposes a substrate with a predetermined pattern, comprising:
Dependencies are inferred from the claim text.