Antenna package for a wireless communications device
AssigneeLucent Technologies Inc.
InventorsIlya A. Korisch, Louis T. Manzione, Ming-Ju Tsai, Yiu-Huen Wong
Life of this patent
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Abstract
An antenna package for use in a wireless communications device. The package includes a metallic leadframe section having a plurality of leads and a paddle shaped as a planar antenna, and dielectric material encapsulating the paddle and portions of the leads.
Claims9
A method for fabricating an antenna package for use in a wireless communications device, comprising the steps of:
- providing a metallic leadframe section having a plurality of leads and a paddle shaped as an antenna;
- providing a mold having a parting line and at least one cavity;
- positioning the leadframe section along the mold parting line and in registration with a mold cavity;
- filling the mold cavity with molten dielectric material so as to encapsulate the paddle and portions of the leads;
- allowing the dielectric material to harden;
- removing the encapsulated leadframe section from the mold;
- and
- trimming the unencapsulated portions of the plurality of leads.
An antenna package for use in a wireless communications device, comprising:
- a metallic leadframe section having a plurality of leads and a paddle shaped as an antenna;
- and
- dielectric material encapsulating the paddle and portions of the leads.
In combination with a wireless communications device having an insulative outer case and electrical components supported on a printed circuit board mounted within the case, an internal antenna package comprising:
- a plastic piece molded to fill a portion of the interior space of the device between the outer case and the printed circuit board;
- and
- an antenna on a surface of the plastic piece remote from the printed circuit board.
Dependencies are inferred from the claim text.