Process for the electrical testing of the base material for the manufacture of printed circuit boards
AssigneeHewlett-Packard Company
InventorHermann Barth
Life of this patent
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Abstract
For the electrical testing of base material for manufacturing printed circuit boards, firstly smooth edges to the copper layers of the base material, free of deformation, are produced, preferably in a milling process, which base material is subsequently subjected to testing for a sufficiently high level of electrical resistance between the two copper layers. Successful resistance testing is followed by testing for the dielectric strength of the insulating layer of the base material by measuring the current conduction produced as a result of a disruptive breakdown. This process serves to reduce the amount of processed base material which is rejected, on which, at the present state of the art, there is no electrical testing prior to processing.
Claims12
A process for electrical testing of a base material for manufacture of a printed circuit board, the process comprising the steps of:
- providing the base material, the base material having electrically conductive layers arranged on both sides of an insulating layer;
- reducing deformations at edges of one or more of the conductive layers to reduce potential short circuits between the conductive layers;
- measuring electrical resistance between the two conductive layers by applying a test voltage thereto;
- and
- rejecting the base material if the resistance is less than a predetermined value.
A process for producing a printed circuit board from a base material having at least two electrically conductive layers spaced apart by an insulating layer, the process comprising the steps of:
- a) reducing deformations at edges of one or more of the conductive layers to reduce potential short circuits between the conductive layers;
- b) testing the integrity of the insulating layer;
- and subsequent to step b),
- c) configuring the circuit board to create at least one conductive path through the insulating layer, and thereby connect one conductive layer to another.
Dependencies are inferred from the claim text.