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US 6,285,086 B1Granted
Semiconductor device and substrate for semiconductor device
AssigneeSharp Kabushiki Kaisha
InventorsYoshiki Sota, Hiroyuki Juso
Life of this patent
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Abstract
In a substrate for a semiconductor device including a plurality of first through holes and a wiring pattern having a conductive land portion covering the entire surface of the opening of each of the first through holes on one surface, a second through hole is formed in a region other than the forming region of the wiring pattern, and the shape of opening of said second through hole is not a circular shape and has a corner portion.
Claims16
A substrate for a semiconductor device comprising:
- an insulating substrate having one surface, the other surface opposing the one surface and a plurality of first through holes communicating between the one surface and the other surface;
- and
- a conductive layer having a conductive portion formed to cover the opening of said first through hole in the one surface of said insulating substrate,
- a second through hole communicating between the one surface and the other surface being formed in a region of said insulating substrate without said conductive layer, the opening of said second through hole having a corner portion.
1 more element
A semiconductor device comprising:
- an insulating substrate having one surface, the other surface opposing the one surface, and a plurality of first through holes communicating between the one surface and the other surface;
- a conductive layer having a conductive portion formed to cover the opening of said first through hole in the one surface of said insulating substrate;
- and
- a semiconductor chip mounted on the one surface of said insulating substrate,
- a second through hole communicating between the one surface and the other surface being formed in a region of said insulating substrate without said conductive layer, the shape of the opening of said second through hole having a corner portion,
- said conductive layer and said semiconductor chip being electrically connected.
3 more elements
Dependencies are inferred from the claim text.