Semiconductor device

Abstract

A semiconductor device is including a first semiconductor chip, and a second semiconductor chip stacked on the first semiconductor chip and bonded to a surface of the first semiconductor chip. The first semiconductor chip and the second semiconductor chip are formed with a first element and a second element, respectively, which are provided in an opposed relation and adapted to be coupled to each other in an electrically isolated state for signal transmission. The first semiconductor chip has an external connector isolated from the first element and electrically connected to the second element. The first semiconductor chip may have a protective circuit for prevention of insulation breakdown between the first element and the second element. Further, the first semiconductor chip may have an insulating film provided on a surface of a semiconductor substrate thereof, and a wiring for connection between the external connector and the second element may be provided on a greatest thickness region of the insulating film.

Dependencies are inferred from the claim text.