Planar metallized substrate with embedded camber control material and method thereof
AssigneeInternational Business Machines Corporation
InventorsRaschid J. Bezama, Kenneth A. Bird, Alan Piciacchio, Robert A. Rita
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Abstract
The present invention relates generally to new planar substrates that are metallized and embedded with material to minimize the camber and method thereof. The invention also relates to the fabrication of multilayer ceramic (MLC) substrates for packaging electronic devices. More particularly, this invention relates to the fabrication of thin and small ceramic substrates which do not need post-sintering processing to control the flatness of the sintered product.
Claims22
A multilayer ceramic substrate comprising at least four ceramic layers with at least two internal voltage planes, wherein said at least two internal voltage planes are screened with the same electrically conductive metal paste and have a difference in metal volume coverage of at least about 10 percent, and wherein said substrate has a camber of less than about 50 microns.
A multilayer ceramic substrate comprising at least four ceramic layers with at least two internal voltage planes, wherein said at least two internal voltage planes are screened with at least two different electrically conductive metal pastes and have a difference in metal volume coverage of at least about 10 percent, and wherein said substrate has a camber of less than about 50 microns.
A multilayer ceramic substrate comprising at least four ceramic layers with at least two internal voltage planes, wherein at least a portion of at least one internal voltage plane is screened with at least two different electrically conductive metal pastes, and wherein said substrate has a camber of less than about 50 microns.
Dependencies are inferred from the claim text.