US 6,285,077 B1Granted

Multiple layer tape ball grid array package

AssigneeLSI Logic Corporation

InventorsChok J. Chia, Seng-Sooi Allen Lim, Qwai Hoong Low

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Abstract

A package for an integrated circuit is disclosed. The package comprises two layers (a top layer and a bottom layer) of flexible tape, each of which has a top surface and a bottom surface, with metal traces on the top surface. A die is mounted on top of the two layers and wire bonds connect bond pads on the die to metal traces on each of the two flexible tapes. The metal traces are routed along the top surfaces of the flexible tapes and are coupled to solder balls through holes in the tapes. These solder balls are mounted along the bottom of the package and serve as the electrical interface to a printed circuit board. Additional holes in the bottom layer tape allow solder balls to extend through the bottom layer tape so that they may be electrically coupled to traces on the top layer tape.

Claims12

Dependent claims

A package for an integrated circuit, comprising:

a first flexible tape having a top surface and a bottom surface, the first flexible tape having metal traces;
a first plurality of solder balls, each of the first plurality of solder balls electrically coupled to a corresponding one of the traces on the first flexible tape;
a die having a top surface and a bottom surface, the die having bond pads on its top surface, the die mounted such that its bottom surface faces the top surface of the first flexible tape;
a first wire connecting a first one of the bond pads on the die with one of the traces on the fist flexible tape;
a second plurality of solder balls, each of the second plurality of solder balls electrically coupled to a corresponding one of the traces on the second flexible tape;
a second wire connecting a second one of the bond pads on the die with one of the traces on the second flexible tape;
wherein
at least a portion of the first flexible tape lies in a plane that is both (a) substantially parallel to both the bottom surface of the die and the top surface of the second flexible tape, and (b) between the bottom surface of the die and the top surface of the second flexible tape.

5 more elements

Dependencies are inferred from the claim text.