Electronic device and method for manufacturing the same

Abstract

In producing an electronic device such as an overcurrent-protection element, a large substrate 21 is prepared with a plurality of element mounting sections 50. Electrodes 25 and 26 are formed on the surface of the substrate 21 in each of the element mounting sections 50. A fine metal wire 27 is connected between the electrodes 25 and 26 to form a fuse element. A framework portion 41 surrounds each element mounting section 50, forming a depression 24. The depression 24 houses the fine metal wire 27. A cover member 31 is placed over the top of the framework 41, hermetically sealing the depressions 24. Subsequently, the cover member 31 and substrate 21 are cut together, separating each of the element mounting sections 50 to obtain individual electronic devices.

Dependencies are inferred from the claim text.