Linear image sensor device, IC assembling substrate and method for assembling the same

Abstract

A linear image sensor IC comprising a plurality of switching circuits each connected to a plurality of light receiving elements in series; scanning circuits for sequentially switching said switching circuits; and driving circuits for operating said scanning circuits, wherein a LOCOS isolation layer is formed between an edge in the main scanning direction of the linear image sensor IC which is closest to an array of the light receiving elements and a light receiving portion of the light receiving element. The inventive image sensor IC is mounted by devising so that the circuit can be put into a thin and long pattern in the scanning direction, so that the chip having a width thinner than a thickness thereof which had been beyond expectation by the prior art can be realized. The use of this very thin IC allows a compact IC assembling substrate having less fluctuation among ICs to be manufactured at low cost. Even more, it becomes possible to mount ICs readily on a cylindrical substrate which had been also difficult in the past. Thereby, electronic devices such as a compact and low cost multi-chip type image sensor or multi-chip type thermal head can be realized. Accordingly, it becomes possible to bring down the cost thereof, which had been difficult in the past, and to realize a low cost facsimile.

Dependencies are inferred from the claim text.