Method for laser soldering a three dimensional component

A method of forming an electronic assembly, comprising the steps of:

• providing a surface mount electronic component having at least two terminations on an underside surface thereof;
• a dielectric substrate having a first surface on a first side thereof, a second surface on a second side thereof, and at least two mounting pads arranged on the first surface in matched relation with the terminations of the electronic component;
• and a diode laser;
• depositing solder paste atop the mounting pads;
• placing the electronic component atop the substrate such that each termination rests generally atop its respective mounting pad;
• securing said component to said substrate and thereafter, forming a circuit assembly housing from said substrate so that said first side is within said housing and said second side form an exterior of said housing;
• and
• directing laser energy from the diode laser to at least one of the mounting pads from the second side of the substrate for a predetermined time, such that the solder paste atop the at least one of the mounting pads is melted.

A method for laser soldering, comprising the steps of:

• providing an electronic component having at least two terminations thereon;
• a substantially flat dielectric substrate having a first surface on a first side thereof, a second surface on a second side thereof, and at least two mounting pads arranged on the first surface in matched relation with the terminations of the electronic component;
• and a diode laser;
• depositing solder paste atop the mounting pads;
• placing the electronic component atop the substrate such that each termination rests generally atop its respective mounting pad;
• forming a three dimensional structure having from said substrate so that said second side in within said three dimensional structure;
• after the step of forming a three-dimensional structure, directing laser energy from the diode laser to at least one of the mounting pads from the second side of the substrate for a predetermined time, such that the solder paste atop the at least one of the mounting pads is melted;
• and
• allowing a solid solder joint to form atop each of the at least one of the mounting pads immediately after said step of directing laser energy, such that each solder joint mechanically and electrically connects its respective component termination with its respective mounting pad.