Method for mounting integrated circuits on printed circuit boards
AssigneeSamsung Electronics Co., Ltd.
InventorsChoul-Su Kim, Woo-Sik Kim, Byung-Woo Woo, Masaharu Tsukue
Life of this patent
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Abstract
An improved method for mounting tape carrier package type integrated circuits on printed circuit boards. In the method, some of leads of the integrated circuit are preliminarily soldered with corresponding lead pattern on the printed circuit board after the integrated circuit is aligned on the printed circuit board so that the integrated circuit is prevented from being disordered while the printed circuit board including the integrated circuit aligned thereon is transferred to a soldering apparatus.
Claims18
A method of mounting an integrated circuit on a printed circuit board, comprising the steps of:
- aligning an integrated circuit with a lead pattern on a printed circuit board, the integrated circuit having a total quantity of leads, said total quantity of leads including a first plurality of leads and a second plurality of leads;
- first soldering the second plurality of leads with the lead pattern, said first soldering corresponding to a preliminary soldering, said first soldering being performed by a hot gas nozzle, said first soldering holding the integrated circuit and the printed circuit board in said alignment;
- and
- after said first soldering, second soldering the first plurality of leads with the lead pattern by applying a beam of energy.
A method of mounting an integrated circuit on a printed circuit board, comprising the steps of:
- moving a printed circuit board to a processing position;
- blowing the printed circuit board with gas to remove contamination from the printed circuit board;
- applying a flux to an integrated circuit lead pattern on the printed circuit board;
- aligning an integrated circuit and the integrated circuit lead pattern of the printed circuit board, the integrated circuit having a first plurality of leads and a second plurality of leads;
- after the lead pattern and the integrated circuit are aligned, first soldering the second plurality of leads of the integrated circuit with said integrated circuit lead pattern on the printed circuit board corresponding to the second plurality of leads, said first soldering corresponding to a preliminary soldering, said preliminary soldering being performed by a nozzle unit spraying hot gas, said first soldering holding the integrated circuit and the printed circuit board in said alignment;
- after said first soldering, second soldering the first plurality of leads with said integrated circuit lead pattern on the printed circuit board by applying a beam of energy from a soldering unit, said second soldering corresponding to a complete soldering;
- cooling the printed circuit board;
- and
- moving the printed circuit board from the processing position.
Dependencies are inferred from the claim text.