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US 6,284,982 B1Granted
Method and component for forming an embedded resistor in a multi-layer printed circuit
AssigneeGA-TEK Inc.
InventorsMark Kusner, Michael A. Centanni
Life of this patent
Estimating the term…
Abstract
A component for use in forming a multi-layer printed circuit comprised of a film substrate formed of a first polymeric material. At least one layer of a flash metal is applied to a first side of the film substrate, and at least one layer of copper is applied on the layer of flash metal. A discrete area of a resistive material is disposed on a second side of the film substrate.
Claims5
A multi-layer printed circuit, comprising:
- a) an inner core formed from one or more printed circuit laminates, said printed circuit laminates comprised of a core substrate having a first surface with a strip conductor disposed thereon,
- b) at least one surface component attached to said inner core, said surface component, comprised of:
- a film substrate formed of a first polymeric material;
- at least one layer of copper on a first side of said film substrate;
- and
- a discrete area of a resistive material disposed on a second side of said film substrate, said surface component attached to said inner core with said discrete area of resistive material embedded within said multi-layer printed circuit between said core and said film substrate,
- c) a first through hole connecting one end of said discrete area to a first circuit trace line of said multi-layer printed circuit;
- and
- d) a second through hole connecting another end of said discrete area to a second trace line of said multi layer printed circuit.
6 more elements
Dependencies are inferred from the claim text.