Molding compositions comprising random copolyamides, their use, and process for their preparation

A molding composition comprising components A, B and, if desired, components C and D, the total weight of which is 100% by weight:

• a:
• as component A, from 5 to 95% by weight of a random copolyamide made from
• a1:
• from 95.5 to 99.9% by weight of component A1 made from equimolar amounts of at least one linear aliphatic diamine and at least one linear aliphatic dicarboxylic acid
• a2:
• from 0.1 to 4.5% by weight of component A2 made from equimolar amounts of at least one linear aliphatic diamine and isophthalic acid
• b:
• as component B, from 5 to 95% by weight of a component B, different from component A, selected from:
• b1:
• component B1 made from at least one polyarylene ether, or
• b2:
• component B2 made from, as component B21, from 60 to 99% by weight of at least one polyolefin homo- or copolymer and, as component B22, from 1 to 40% by weight of at least one polyolefin homo- or copolymer modified by incorporation of at least one monomer which contains a member selected from the group consisting of carboxy, anhydride, amide, imide, carboxylic ester, amino, hydroxyl, epoxy, oxazolyl, urethane, urea, lactam and which has a double bond, or
• b3:
• component B3 made from, as component B31, from 70 to 100% by weight of at least one SAN, ABS or ASA polymer and, as component B32, from 0 to 30% by weight of at least one SAN, ABS or ASA polymer modified by the incorporation of at least one carbonyl, anhydride, amide, imide, carboxylic ester, carboxyl, amino, hydroxyl, epoxy, oxazoline, urethane, urea, lactam or halobenzyl group
• c:
• as component C, from 0 to 20% by weight of at least one impact modifier not covered by components B21, B22, B31 or B32, and
• d:
• as component D, from 0 to 50% by weight of at least one filler.