Encapsulant composition and electronic device
AssigneeHitachi Chemical Company, Ltd.
InventorsTatsuo Kawata, Hiroyuki Sakai, Terumi Tsukahara
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Abstract
In the present invention, provided are i) an encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide; the inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition, and the hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin, and ii) an electronic device having an encapsulating member comprising a cured product of this encapsulant composition.
Claims6
An encapsulant composition comprising an epoxy resin, a curing agent, an inorganic filler, an adduct of triphenylphosphine with benzoquinone, and a hydrous bismuth nitrate oxide;
- said inorganic filler being mixed in an amount of from 70% by volume to 85% by volume based on the total weight of the encapsulant composition;
- and
- said hydrous bismuth nitrate oxide being mixed in an amount of from 2.5 parts by weight to 20 parts by weight based on 100 parts by weight of the epoxy resin.
Dependencies are inferred from the claim text.