Plasma processing device and a method of plasma process
AssigneesTokyo Electron Limited, Fuji Electric Co., Ltd.
InventorsMakoto Toraguchi, Satoru Kawakami
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AssigneesTokyo Electron Limited, Fuji Electric Co., Ltd.
InventorsMakoto Toraguchi, Satoru Kawakami
Estimating the term…
Disclosed is a plasma process apparatus which permits generating microwaves and a magnetic field so as to bring about electron cyclotron resonance and, thus, to generate a plasma which is applied to a semiconductor wafer, comprising microwave generating means for generating said microwaves, microwave transmitting means for transmitting the microwaves, a process chamber having said semiconductor wafer arranged therein, the microwaves being introduced into said process chamber through said microwave transmitting means, process gas supply means for supplying a process gas into said process chamber, and magnetic field generating means for generating a magnetic field within the process chamber. The frequency of the microwave falls within a range between a lower limit of a cutoff frequency determined by the inner diameter of the process chamber and an upper limit of a maximum frequency at which a standing wave of the microwave does not occur on the surface of the object.
A method of setting conditions of a microwave and a magnetic field in a plasma process apparatus in which the microwave and the magnetic field are generated to bring about electron cyclotron resonance, thereby generating a plasma which is applied to an object to be processed,
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