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US 6,284,617 B1Granted
Metalization outside protective overcoat for improved capacitors and inductors
AssigneeTexas Instruments Incorporated
InventorsJohn P. Erdeljac, Louis Nicholas Hutter, M. Ali Khatibzadeh, John Kenneth Arch
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Abstract
A thick layer of copper is formed on the outside the protective overcoat (PO) which protects an integrated circuit, and forms both an inductor and the upper electrode of a capacitor. Placing this layer outside the PO greatly reduces parasitic capacitances with the substrate in the devices.
Claims1
A fabrication method, comprising the steps of:
- (a.) forming a first circuit portion which includes a first electrode of a capacitor;
- (b.) covering said first circuit portion with a protective overcoat;
- (c.) forming openings through said protective overcoat including bond pad openings and an opening at said first electrode;
- (d.) depositing a capacitor dielectric over exposed portions of said first electrode;
- and
- (e.) forming a second electrode of said capacitor overlying said first electrode, said second electrode at least partially overlying said protective overcoat.
3 more elements
Dependencies are inferred from the claim text.