Method for fabricating ferroelectric memory devices capable of preventing volatility of elements in ferroelectric films

Abstract

The present invention relates to a highly integrated memory device; and, more particularly, to a ferroelectric capacitor memory device capable of improving an electrical interconnection between a lower electrode and an active region of a cell transistor. In accordance with an aspect of the present invention, there is provided a method for fabricating a semiconductor capacitor, comprising the steps of: forming a lower electrode of the semiconductor capacitor; forming a ferroelectric film on the lower electrode, wherein the first ferroelectric film bears a volatile element; forming a capping oxide film on the ferroelectric film; applying a rapid thermal process to the ferroelectric film and the capping oxide film; and cooling the ferroelectric film, whereby a preferred orientation of atoms in the ferroelectric film and domain boundaries thereof are perpendicular to a semiconductor substrate for which the semiconductor capacitor is provided.

Dependencies are inferred from the claim text.