Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias

A method for manufacturing a semiconductor component, comprising the steps of:

• providing a substrate;
• forming comb-shaped vias in the substrate;
• mounting a plurality of semiconductor chips on corresponding flag portions of the substrate;
• and
• singulating the substrate to form the semiconductor component.

A method of manufacturing semiconductor components providing electrical interconnects formed during a singulation process, the method comprising:

• providing a conductive substrate containing vias in the conductive substrate from a first surface of the substrate to a second surface of the substrate;
• attaching at least one semiconductor device to the first surface of the substrate to form a semiconductor assembly;
• encapsulating the semiconductor assembly;
• and singulating the semiconductor assembly to form the semiconductor components, wherein singulating the semiconductor assembly forms electrical interconnects.