HDI chip attachment method for reduced processing

A method for interconnecting electrical contacts of semiconductor chips in an HDI context, said method comprising the steps of:

• applying laser energy to a dielectric film, to thereby make a pattern of holes in said film, said pattern corresponding in location to the locations of electrodes of semiconductor chips properly aligned in an HDI structure;
• mounting semiconductor chips to a first side of said dielectric film, with said electrodes in registry with said holes, whereby said chips assume said proper alignment;
• and
• applying electrically conductive material to a second side of said film and to at least the sides of said holes, so as to interconnect said electrodes with an interconnect pattern of said electrically conductive material;
• wherein said step of mounting semiconductor chips to a first side of said dielectric film includes the steps of (a) applying uncured adhesive to said first side of said dielectric film before said step of applying laser energy, (b) mounting said semiconductor chips to said uncured adhesive;
• and (c) curing said adhesive.

A method for interconnecting electrical contacts of semiconductor chips in an HDI context, said method comprising the steps of:

• procuring an optical mask defining an ideal pattern of electrodes of semiconductor chips properly aligned in an HDI structure;
• applying laser energy through said mask to a dielectric film, to thereby make said ideal pattern of holes in said film;
• mounting semiconductor chips to a first side of said dielectric film, with said electrodes in registry with said holes;
• applying electrically conductive material to a second side of said film and to at least the sides of said holes, so as to interconnect said electrodes with an interconnect pattern of said electrically conductive material.