Method of making compliant microelectronic assemblies

A method of making a compliant microelectronic assembly comprising the steps of:

• providing a microelectronic element having a first surface and an array of contacts on said first surface;
• providing a compliant layer over said first surface, said compliant layer having a bottom surface facing toward said first surface of said microelectronic element, a top surface facing upwardly away from said microelectronic element, said compliant layer including one or more apertures therein so that said array of contacts are accessible through said apertures, said compliant layer including one or more aperture edge surfaces bounding said apertures and extending between said top and bottom surfaces of said compliant layer, and then
• selectively forming flexible bond ribbons over said compliant layer so that said bond ribbons extend over said top surface and at least some of said aperture edge surfaces, said bond ribbons electrically connecting said contacts to conductive terminals overlying the top surface of said compliant layer.