US 6,284,561 B1Granted

Method of forming a metal plate of a fingerprint sensor chip on a semiconductor wafer

AssigneeUnited Microelectronics Corp.

InventorTz-Ian Hung

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Abstract

The present invention provides a method of forming a metal plate on a semiconductor wafer. The semiconductor wafer comprises a first dielectric layer and two line-shaped conductors positioned on the first dielectric layer, and a recess is formed between the two conductors and above the surface of the first dielectric layer which comprises two corners. The method comprises forming a second dielectric layer uniformly on the two conductors and the recess, and forming a plurality of approximately rectangular metal plates on the second dielectric layer, then forming a passivation layer on the semiconductor wafer for protecting the inner circuitry. The surface of the passivation layer above the recess is higher than the surface of the passivation layer above the conductors, and the passivation layer formed above each metal plate has an even surface.

Claims18

Dependent claims

A method of forming a metal plate on a semiconductor wafer, the semiconductor wafer comprising a first dielectric layer and two line-shaped conductors positioned on the first dielectric layer, each of the two line-shaped conductors comprising two vertical side walls positioned on its two opposite sides, a recess being formed between the two conductors and above the surface of the first dielectric layer, and the recess comprising two corners formed between the two vertical side walls of the two conductors in the recess and the surface of the first dielectric layer, the method comprising:

forming two spacers at the two corners of the recess by using a filling material to create two slopes above the two corners;
forming a second dielectric layer on the two conductors and the recess, the second dielectric layer positioned on the recess creating a shallow trench on its top end and its bottom end being higher than the top ends of the two conductors;
forming an approximately rectangular photoresist layer on the shallow trench;
performing a dry-etching process to vertically remove the second dielectric layer positioned on the two conductors and making the top end of the second dielectric layer positioned on each of the two conductors lower than the bottom end of the shallow trench;
removing the photoresist layer;
forming a sacrifice layer on the surface of the second dielectric layer by using a spin-coating method;
performing an etching-back process on the sacrifice layer and the second dielectric layer to form an approximately rectangular platform above the recess and two shallow trenches above the two conductors, and the comparative etching ratio of the second dielectric layer to the sacrifice layer is 0.9˜1.2 during the etching-back process;
forming a metal layer on the second dielectric layer and performing a photolithographic process and an etching process to remove the metal layer outside the platform so as to form an approximately rectangular metal plate on top of the platform;
and
forming a third dielectric layer on the semiconductor wafer for protecting the metal plate.

7 more elements

forming two spacers at the two corners of the recess by using a filling material to create two slopes above the two corners;
forming a second dielectric layer uniformly on the two conductors and the recess, the second dielectric layer positioned on the recess creating a shallow trench on its top end and its bottom end being higher than the top ends of the two conductors;
forming an approximately rectangular metal plate inside the recess;
forming a third dielectric layer uniformly on the second dielectric layer and the metal plate;
forming an approximately rectangular photoresist layer on the third dielectric layer and positioned above the metal plate;
performing a dry-etching process to vertically remove the third dielectric layer positioned on the two conductors and making the top end of the third dielectric layer positioned on each of the two conductors lower than the top end of the third dielectric layer positioned below the photoresist layer;
removing the photoresist layer;
forming a sacrifice layer on the third dielectric layer by using a spin-coating method;
and
performing an etching-back process on the third dielectric layer and the sacrifice layer to form an approximately rectangular platform on the surface of the third dielectric layer above the metal plate and two shallow trenches above the two conductors.

7 more elements

Dependencies are inferred from the claim text.