Process for manufacturing a flip-chip integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorKohji Shinomiya
Life of this patent
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Abstract
A method of producing a packaged semiconductor chip including hardened resin packaging and a polished electrode includes producing an electrode on a first surface of a semiconductor substrate; depositing a glass layer on the first surface of the semiconductor substrate but not on the electrode; depositing a resin layer on the glass layer; curing the resin layer on the glass layer; polishing an external surface of the electrode and the resin layer so that the external surface and the resin layer, after polishing, are substantially planar, thereby producing a flip-chip package; mounting the flip-chip package on a printed circuit board via the electrode; testing the flip-chip package on the printed circuit board; and removing the flip-chip package from the printed circuit board.
Claims7
A method of producing a packaged semiconductor chip including hardened resin packaging and a polished electrode comprising:
- producing an electrode on a first surface of a semiconductor substrate;
- depositing a glass layer on the first surface of the semiconductor substrate but not on the electrode;
- depositing a resin layer on the glass layer;
- curing the resin layer on the glass layer;
- polishing an external surface of the electrode and the resin layer so that the external surface and the resin layer, after polishing, are substantially planar, thereby producing a flip-chip package;
- mounting the flip-chip package on a printed circuit board via the electrode;
- testing the flip-chip package on the printed circuit board;
- and
- removing the flip-chip package from the printed circuit board.
A method of producing a packaged semiconductor chip including hardened resin packaging and a polished electrode comprising:
- producing an electrode on a first surface of a semiconductor substrate;
- depositing a glass layer on the first surface of the semiconductor substrate but not on the electrode;
- depositing a resin layer on the glass layer;
- curing the resin layer on the glass layer;
- polishing an external surface of the electrode and the resin layer so that the external surface and the resin layer, after polishing, are substantially planar, thereby producing a flip-chip package;
- and
- mounting the flip-chip package on a printed circuit board via the electrode, thereby producing a multi-chip module.
Dependencies are inferred from the claim text.