Strippable semiconductive resin composition and wire and cable

Abstract

Disclosed are a strippable semiconductive resin composition adapted for formation of a semiconductive layer having a volume resistivity of not more than 5000 Ω·cm at room temperature, the composition comprising: a polymer component (a), with a number average molecular weight of not less than 3×104 or a weight average molecular weight of not less than 3×105 and a melting point of 60 to 80° C., composed mainly of an ethylene/vinyl acetate copolymer, or a polymer component (b) composed mainly of 99 to 50 parts by weight of the ethylene/vinyl acetate copolymer and 1 to 50 parts by weight of a polyolefin having a melting point of 120° C. or above; and conductive carbon black compounded with the polymer component (a) or (b), and a wire and cable comprising the strippable semiconductive resin composition as an outer semiconductive layer. By virtue of this construction, an outer semiconductive layer can be formed which is excellent in adhesion to an insulator crosslinked by silane grafting/water crosslinking, as well as in strippability.

Dependencies are inferred from the claim text.