Manufacturing method of printed circuit board
AssigneeVictor Company of Japan, Ltd.
InventorsYasuaki Seki, Shigenori Shiratori, Kenji Suzuki
Life of this patent
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Abstract
In a manufacturing method of a printed circuit board comprising a process of coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole and a process of filling up the insulative thermosetting resin in the blind hole, the printed circuit board coated with the insulative thermosetting resin is kept in a low pressure atmosphere of 1.3 to 666 hPa, and then the insulative thermosetting resin is hardened, so that the insulative thermosetting resin is filled up in the blind hole appropriately.
Claims4
A manufacturing method of a printed circuit board having a blind hole comprising steps of:
- coating insulative thermosetting resin on a surface of a printed circuit board having a blind hole so as to form an insulative thermosetting resin layer on the printed circuit board and so as to fill up the blind hole with the insulative thermosetting resin in a normal atmospheric pressure;
- reducing pressure surrounding the printed circuit board coated with the thermosetting resin to a low pressure of 1.3 to 666 hPa;
- keeping the printed circuit board coated with the insulative thermosetting resin in the low pressure atmosphere of 1.3 to 666 hPa;
- increasing pressure surrounding the printed circuit board coated with thermosetting resin to the normal atmospheric pressure;
- and
- hardening the insulative thermosetting resin.
Dependencies are inferred from the claim text.