Method of electroplating and electrodeposit structure
AssigneeFujitsu Limited
InventorsTakahiro Imamura, Masaki Katayama
Life of this patent
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Abstract
A method of electroplating using a photoresist layer on a conductive seed layer. The photoresist layer defines a column-shaped space. Ridges are formed on the wall surfaces of the photoresist layer surrounding the column-shaped space. The ridges extend from the conductive seed layer to the opening of the column-shaped space. The electrolytic solution drives bubbles out of the column-shaped space, so that the column-shaped space is filled with the electrolytic solution without any cavities. In addition, if hydrogen bubbles are generated in the column-shaped space, the electrolytic solution serves to drive the hydrogen bubbles out of the column-shaped space along the corners of the column-shaped space.
Claims7
A method of electroplating, comprising the step of:
- using a photoresist layer on a seed layer so as to form:
- a wall surface surrounding a column space standing on the seed layer;
- and
- at least a ridge on the wall surface extending from the seed layer toward an opening of the column space.
An electrodeposit structure comprising:
- a column body standing on a conductive layer;
- and
- at least a stripe of recession formed on a peripheral surface of the column body so as to extend from the conductive layer toward an upper end of the peripheral surface.
Dependencies are inferred from the claim text.