Film forming method and film forming apparatus
AssigneeTokyo Electron Limited
InventorsYasuhiro Sakamoto, Hidetami Yaegashi
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Abstract
A polyimide solution is supplied to a wafer and the wafer is rotated by means of a spin chuck, thereby forming a polyimide film on the wafer. An irradiator for irradiating a laser beam to a peripheral portion of the wafer W is provided. After the polyimide film is formed and side rinse is performed, a laser beam is irradiated to the peripheral portion to solidify the film at the peripheral portion. The solidified polyimide film forms a weir, thus preventing the polyimide solution which has not dried yet from flowing out toward a peripheral edge portion.
Claims10
A film forming apparatus, comprising:
- a processing solution dispenser that supplies a process solution to a substrate that forms a film of the processing solution with a predetermined thickness on a front surface of the substrate;
- a remover that removes the film of the processing solution in a peripheral edge portion of the substrate;
- and
- a solidifier that solidifier the film of the processing solution in only a peripheral portion located inside and along said peripheral edge portion of the substrate.
A film forming apparatus, comprising:
- a processing solution dispenser that supplies a process solution to a substrate that forms a film of the processing solution with a predetermined thickness on a front surface of the substrate;
- a remover that removes the film of the processing solution in a peripheral edge portion of the substrate;
- and
- a solidifier that solidifier the film of the processing solution in only a peripheral portion located inside and along said peripheral edge portion of the substrate;
- wherein said solidifier is an irradiator that discharges a laser beam to the substrate;
- a positioning device that moves the irradiator at least between the peripheral portion and the peripheral edge portion of the substrate;
- said remover removing the film of the processing solution formed at the peripheral edge portion of the substrate by the laser beam.
A film forming apparatus, comprising:
- a process solution dispenser that supplies process solution to a substrate that forms a film of the process solution with a predetermined thickness on a surface of the substrate;
- a remover that removes the film of the process solution from a peripheral edge portion of the substrate;
- and
- a solidifier that solidifies the film of the process solution in only a peripheral portion located inside and along said peripheral edge portion of the substrate, said solidifier including a solidifying element movable toward said peripheral portion.
Dependencies are inferred from the claim text.