Solution treatment apparatus
AssigneeTokyo Electron Limited
InventorTakashi Takekuma
Life of this patent
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Abstract
In a solution treatment apparatus, a nozzle for discharging a treatment solution toward a substrate held by a spin chuck includes a discharge opening for discharging the treatment solution on a surface of the substrate. A collision body against which the treatment solution discharged from the nozzle collides is disposed between the discharge opening of the nozzle and the substrate. Since the collision body is disposed between the discharge opening and the substrate, even when the discharge pressure of the treatment solution is high, the discharged treatment solution once collides against the collision body so that the discharge speed on reaching the substrate is reduced, damage to the substrate is eased, and the amount of air entering into the discharged treatment solution is decreased. Accordingly, no micro-bubble occurs.
Claims13
A solution treatment apparatus comprising;
- means for holding a first surface of a substrate having the first surface and a second surface on which a photoresist film is formed, and for rotating the substrate;
- a linear nozzle, having at least one discharge opening, for discharging a treatment solution through the discharge opening toward the second surface of the rotated substrate;
- means for supplying the treatment solution to said nozzle;
- and
- a linear bar, disposed between the discharge opening of said linear nozzle and the second surface of the substrate such that said linear bar is located along said linear nozzle and close to the discharge opening thereof, against which the treatment solution discharged from said linear nozzle collides.
Dependencies are inferred from the claim text.