Cleaning and slurry distribution system assembly for use in chemical mechanical polishing apparatus
AssigneeApplied Materials, Inc.
InventorSidney Huey
Life of this patent
Estimating the term…
Abstract
A cleaning and slurry distribution assembly for use in a chemical mechanical polishing apparatus. The cleaning assembly includes a plurality of nozzles for directing a cleaning fluid against a polishing pad. The cleaning assembly further includes a housing for containing residual droplets, slurry and contaminants. The slurry distribution assembly includes a ring for optimally distributing slurry on the polishing pad.
Claims18
An apparatus for use in a chemical mechanical polishing system, comprising:
- a housing positionable over a polishing surface and movable in a direction normal to the polishing surface, wherein a part of the housing that covers the nozzle contacts the polishing surface to enclose the polishing surface beneath the nozzle;
- and
- at least one nozzle covered by the housing to spray a cleaning fluid against the polishing surface.
An apparatus for use in a chemical mechanical polishing system, comprising:
- a housing positionable over a polishing surface;
- at least one nozzle covered by the housing to spray a cleaning fluid against the polishing surface;
- and
- a retainer joined to a lower surface of the housing, wherein the retainer contacts a surface of the polishing surface.
An apparatus for use in a chemical mechanical polishing system, comprising:
- a housing assembly positionable over a polishing surface, wherein the assembly includes a first feed line to supply a cleaning fluid, a second feed line to supply an aqueous solution of deionized water and an agent selected from the group consisting of a corrosion inhibitor, an oxidize, a cleaner, a pH adjustor, a dilution fluid, and a surface wetting agent, and a third feed line to supply an abrasive solution;
- and
- at least one nozzle covered by the housing to spray the cleaning fluid against the polishing surface.
A method of cleaning the surface of a polishing pad in a chemical mechanical polishing system, comprising:
- lowering a housing of a cleaning assembly into close proximity of a polishing surface;
- directing a cleaning fluid from the cleaning assembly against the polishing surface that has residual contaminants;
- substantially containing the cleaning fluid within the housing of the cleaning assembly;
- and
- raising the housing away from the polishing surface to expel the cleaning fluid and residual contaminants from the polishing pad.
Dependencies are inferred from the claim text.