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US 6,283,837 B1Granted
Grinding machine
AssigneeWacker Siltronic Gesellschaft fur Halbleitermaterialien AG
InventorRobert Vorbuchner
Life of this patent
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Abstract
A grinding machine has a swivel head (1) with at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the workpiece.
Claims4
A method for grinding a semiconductor bar, and said semiconductor bar having a length and a diameter, comprising
- providing a swivel head (1) having at least one plunge-grinding wheel (2), a cup wheel (3) and a measuring gauge (7) for measuring the diameter and the length of the semiconductor bar;
- pivoting the swivel head (1) through 180°, wherein it is possible for either the plunge-grinding wheel (2) or the cup wheel (3) to grind the semiconductor bar (6);
- and
- grinding the semiconductor bar (6) by plunge grinding and by cup grinding.
1 more element
Dependencies are inferred from the claim text.