Method and apparatus for manufacturing a semiconductor integrated circuit
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorsShigeru Harada, Takashi Yamashita, Noriaki Fujiki, Tsutomu Tanaka
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Abstract
A method and an apparatus for manufacturing a semiconductor integrated circuit in which semiconductor elements (2) and a wiring structure connecting the semiconductor elements (2) one another are located on a semiconductor substrate (1). In the method or apparatus, a series of wiring elements (4,6,7,9,10), each of which constructs the wiring structure is formed sequentially, then the semiconductor integrated circuit under manufacturing process is washed by neutral solution containing oxidant during the process of forming of the wiring elements (4,6,7,9,10).
Claims11
An apparatus for manufacturing a semiconductor integrated circuit comprising:
- rotatable holding means for holding and rotating said semiconductor integrated circuit;
- and
- neutral solution feeding means for feeding neutral solution containing oxidant onto said semiconductor integrated circuit.
An apparatus for manufacturing a semiconductor integrated circuit comprising:
- rotatable holding means for holding and rotating said semiconductor integrated circuit;
- neutral solution feeding means for feeding neutral solution containing oxidant onto said semiconductor integrated circuit;
- and
- brush rotating means for pushing brushes onto said semiconductor integrated circuit and rotating said brushes.
An apparatus for manufacturing a semiconductor integrated circuit comprising:
- rotatable holding means for holding and rotating said semiconductor integrated circuit;
- and
- neutral solution feeding means for pressurizing neutral solution containing oxidant thus to feed said pressurized neutral solution onto said semiconductor integrated circuit.
An apparatus for manufacturing a semiconductor integrated circuit comprising:
- rotatable holding means for holding and rotating said semiconductor integrated circuit;
- neutral solution feeding means for feeding neutral solution containing oxidant onto said semiconductor integrated circuit;
- and
- ultrasonic wave adding means for adding ultrasonic wave into said neutral solution.
An apparatus for manufacturing a semiconductor integrated circuit comprising:
- rotatable holding means for holding and rotating said semiconductor integrated circuit;
- neutral solution feeding means for feeding neutral solution containing oxidant onto said semiconductor integrated circuit;
- and
- fine particles blowing means for blowing at least one of fine particles water or fine particles of ice onto said semiconductor integrated circuit.
Dependencies are inferred from the claim text.