Wire saw cutting method and apparatus therefor
AssigneeSumitomo Metal Industries, Ltd.
InventorsKazunori Onizaki, Kenji Ogawa
Life of this patent
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Abstract
An object of the present invention is to provide a wire saw cutting method that is a method for cutting a plurality of silicon monocrystal ingots into wafers with a wire saw, wherewith high-precision cutting processing is possible, reducing wafer thickness and warping defects, etc. By shifting the positions of pieces of work in the cutting feed direction, providing time differentials to the cuts, and cutting the work sequentially, the work cut first is given the role of a wire guide, making it possible to stabilize the path of the wire. Thus cuts can be made in other ingots with the wire path stabilized, it becomes possible to reduce thickness and warping defects, and processing is made possible wherewith good wafer quality and stable yield are realized.
Claims5
A cutting method using a wire saw for cutting a plurality of objects by bringing said objects and a plurality of wire lines arrayed at predetermined intervals into contact, the method comprising a step of, upon commencement of cutting of said plurality of objects, initiating an individual cutting in each of said objects successively following a time lag between each individual cutting.
A wire saw apparatus comprising a support for supporting a plurality of objects to be cut and enabling said objects to move close to and away from a plurality of wire lines arrayed at predetermined intervals to cut said objects by contacting said objects to said wire lines or contacting said wire lines to said objects;
- and a means for varying a predetermined distance between said wire lines and said objects, said distance being set prior to initiating cutting so as to initiate cutting in each of said objects successively following a time lag between each cutting.
Dependencies are inferred from the claim text.