Semiconductor light-emitting device
AssigneeKabushiki Kaisha Toshiba
InventorsMasahiro Yamamoto, Hidetoshi Fujimoto, Shin-ya Nunoue
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Abstract
A light-emitting diode has a GaN-based multi-layer structure arranged on a sapphire substrate. A pair of electrode pads are arranged on a light-output face of the multi-layer structure. The first and second electrode pads have a total projected area set at 25% or less of that of the light-output face. The electrode pads are connected to electrode pads on a mount frame by solder wiring layers arranged on an insulating film covering the side wall of the multi-layer structure.
Claims12
A semiconductor light-emitting device having a light-output face facing in a first direction, comprising:
- a multi-layer structure defining said light-output face and having a plurality of semiconductor layers including a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type stacked on said first semiconductor layer in said first direction to form a pn junction configured to emit light, said second semiconductor layer having a notch which exposes an electrode area of said first semiconductor layer;
- a first main electrode arranged on said electrode area of said first semiconductor layer, and having a first electrode pad which covers a portion of said light-output face and is opaque to the emitted light;
- a second main electrode arranged on said second semiconductor layer, and having a second electrode pad which covers a portion of said light-output face and is opaque to the emitted light, said first and second electrode pads having a total projected area set at 25% or less of that of said light-output face;
- first and second insulating layers arranged on side walls of said multi-layer structure;
- and
- first and second wiring layers arranged on said first and second insulating layers, respectively, and connected to said first and second electrode pads, respectively.
Dependencies are inferred from the claim text.