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US 6,281,496 B1Granted
Observing/forming method with focused ion beam and apparatus therefor
AssigneeSeiko Instruments Inc.
InventorsKazuo Aita, Yasuhiko Sugiyama
Life of this patent
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AssigneeSeiko Instruments Inc.
InventorsKazuo Aita, Yasuhiko Sugiyama
Estimating the term…
A method for obtaining an image of a sample surface using a charged particle beam apparatus without damaging the sample surface is performed by scanning a focused ion beam onto an observation region of the sample surface, detecting secondary charged particles emanating from the sample surface, and producing an image in response thereto. The sample is placed in a water vapor atmosphere while being scanned by the focused ion beam so that a water vapor absorption layer is formed in the observation region of the sample surface. A SIM image is obtained by placing the periphery of the portion to be processed into a water vapor atmosphere and then irradiating and scanning across the sample surface with the focused ion beam in order to prevent damage to the sample surface. In one embodiment, a focused ion beam instrument is used to observe and repair a photomask without damaging the underlying substrate or to the photomask pattern during observation.
An observing method for obtaining an image of the surface of a sample, comprising the steps of:
In a focused ion beam apparatus a gas emission port provided to direct a gas when in a released state to a position where a sample is to be processed, the gas emission port being connected to a water vapor source so that an entire observation area of the sample can be enveloped by a water vapor atmosphere.
In a focused ion beam apparatus:
A charged particle beam apparatus comprising:
A charged particle beam apparatus comprising:
Dependencies are inferred from the claim text.