Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board
AssigneeRohm Co., Ltd.
InventorsSatoshi Nakamura, Masaharu Tanaka
Life of this patent
Estimating the term…
Abstract
A printed board (5) for mounting electronic component, a method for making the same, and an arrangement for connecting a conductive elements (8, 8′) to the printed board are provided. The printed board includes an insulating substrate (50), and at least one metal terminal (53, 54). The substrate is formed with at least one opening (51, 52) penetrating the substrate. The metal terminal is fixed to the substrate so as to bridge the opening, without projecting out of the substrate.
Claims6
A printed board comprising;
- an insulating substrate;
- and
- at least one metal terminal plate;
- wherein the substrate includes at least one opening penetrating the substrate, said at least one metal terminal plate being fixed to the substrate so as to bridge said at least one opening;
- wherein said at least one metal terminal plate has a first end portion and a second end portion opposite to the first end portion;
- wherein the substrate is formed with a plurality of first conductive pads which are spaced from each other in a first direction and soldered to the same first end portion of said at least one metal terminal plate;
- and
- wherein the substrate is also formed with a plurality of second conductive pads which are spaced from each other in said first direction and soldered to the same second end portion of said at least one metal terminal plate, the plurality of the second conductive pads being spaced from the plurality of first conductive pads in a second direction transverse to said first direction across said at least one opening.
A method for making a printed board including an insulating substrate and at least one metal terminal plate, comprising the steps of;
- forming at least one opening in the substrate,
- forming a plurality of first conductive pads on the substrate to flank said at least one opening at a side thereof, the first conductive pads being spaced from each other in a first direction,
- forming a plurality of second conductive pads on the substrate to flank said at least one opening at an opposite side thereof, the second conductive pads being spaced from each other in said first direction, the plurality of the second conductive pads being spaced from the plurality of first conductive pads in a second direction transverse to said first direction across said at least one opening,
- applying solder paste individually to each of the conductive pads,
- lowering said at least one metal terminal plate so that said at least one metal terminal plate bridges said at least one opening, the solder paste at the plurality of first conductive pads coming into contact with a same first end portion of said at least one metal terminal plate, the solder paste at the plurality of second conductive pads coming into contact with a same second end portion of said at least one metal terminal plate opposite to the first end portion,
- heating the solder paste to melt, and
- cooling the solder paste.
Dependencies are inferred from the claim text.