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US 6,281,448 B1Granted
Printed circuit board and electronic components
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorMasahide Tsukamoto
Life of this patent
Estimating the term…
Abstract
A printed circuit board has: a base material layer having a first via hole; and an insulating layer having a second via hole, the insulating layer being provided on one surface of the base material layer, wherein a cross-sectional area of the second via hole is smaller than a cross-sectional area of said first via hole, and wherein the first and second via holes are filled with a conductive material.
Claims22
A resin printed circuit board comprising:
- a base material layer made of an insulative resin and having a first via hole;
- and
- an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer,
- wherein said first and second via holes are filled with a conductive material, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
1 more element
An electronic component package comprising:
- a base material layer made of an insulative resin and having a first via hole, said base material having a copper foil pad attached to one surface;
- an insulating layer having a second via hole, said insulating layer being provided on another surface of said base material;
- and
- an electronic component having an electrode so as to correspond to a position of said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, wherein said first and second via holes are filled with a conductive material, and wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer.
1 more element
An electronic component package comprising:
- a base material layer made of an insulative resin and having a first via hole;
- an insulating layer having a second via hole, said insulating layer being provided on a surface of said base material;
- and
- an electronic component having an electrode so as to correspond to a position of said second via hole, wherein said second via hole has inclining interior walls that define the cross-sectional area of said second via hole at a surface of said insulating layer to be smaller than the cross-sectional area of said second via hole at an internal portion of said insulating layer, said internal portion of said insulating layer being nearer to said base material layer than said surface of said insulating layer, wherein said first and second via holes are filled with a conductive material, and wherein said conductive material with which said first via hole is filled is solderable.
1 more element
A printed circuit board comprising:
- a base material layer having a first via hole;
- and
- an insulting layer having a second via hole, said insulating layer being provided on at least one surface of said base material layer,
- wherein said first and second via holes each are filled with a conductive material, wherein said conductive material filling first via hole is different from said conductive material filling said second via hole, wherein a cross-sectional area of said second via hole is smaller than a cross-sectional area of said first via hole, and wherein a part of said conductive material from said second via hole also is embedded in said first via hole.
1 more element
Dependencies are inferred from the claim text.