Device and method for connecting two electronic components
AssigneeNEC Corporation
InventorTakashi Yokoyama
Life of this patent
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Abstract
A connection device for use in connection between two electronic components and a connection device provided on a first electronic component. The connection device includes two metal layers which have mutually different coefficients of thermal expansion, and a plurality of side wall pieces that are provided on the metal layers so as to form a connecting space for a second electronic component.
Claims7
A connection device for use in connection between a first electronic component and a second electronic component, said connection device being provided on said first electronic component, said first electronic component comprising two metal layers having mutually different coefficients of thermal expansion, and a plurality of side wall pieces provided on said metal layers so as to form a connecting space to be used for connecting said first electronic component to said second electronic component.
A method for making a connection between a first electronic component and a second electronic component, wherein said first electronic component having two metal layers having mutually different coefficients of thermal expansion, and a plurality of side wall pieces that are provided on said metal layers so as to form a connecting space for said second electronic component,
- said method comprising;
- a first step of extending an aperture of said connecting space formed by said side wall pieces by applying heat to said two metal layers,
- a second step of inserting a connection member of said second electronic component into said connecting space, and
- a third step of narrowing said aperture of said connecting space by cooling said two metal layers.
Dependencies are inferred from the claim text.