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AssigneeInternational Business Machines Corporation
InventorsSteven W. Anderson, Gregg J. Armezzani, Daniel P. Labzentis
Estimating the term…
An electrical connection between a flexible circuitized substrate and a separator conductor is formed wherein the substrate's dielectric member has a region of reduced thickness immediately adjacent the portion of the substrate's conductor that is being connected (e.g., using thermocompression bonding) to the separate conductor (e.g., a chip's contact site or a solder ball thereon). Heat and pressure is applied to form the bond between both conductors, this heat passing through the reduced thickness dielectric while appropriate pressure is applied. The reduced thickness assures heat flow (and possibly displacement of the dielectric in this region, e.g., it “melts back”) to thus facilitate bond formation, but also is able to positively retain several conductors of the substrate in spaced alignment during the bonding to respective solder balls or chip contact sites.
A method of forming an electrical connection between a conductive member and a conductor, said conductive member comprising:
A method of forming an electronic package including a flexible circuitized substrate and an electrical component comprising the steps of:
An electrical connection comprising:
An electronic package comprising:
Dependencies are inferred from the claim text.