Platinum-containing materials and catalysts

A platinum-comprising material, comprising:

• a silicon-comprising substrate having a conductively-doped diffusion region extending therein;
• a roughened platinum layer over the substrate and in electrical contact with the diffusion region, the roughened platinum layer having a continuous surface characterized by columnar pedestals having heights greater than or equal to about one-third of a total thickness of the roughened platinum layer;
• and
• an adhesion layer between the roughened platinum layer and the silicon-comprising substrate, the adhesion layer comprising at least one of titanium nitride, iridium, rhodium, ruthenium, platinum, palladium, osmium, and silver.

A platinum-containing material, comprising:

• a substrate;
• an adhesion layer over the substrate, the adhesion layer comprising at least one of titanium nitride, iridium, rhodium, ruthenium, palladium, osmium, and silver;
• and
• a roughened platinum layer on the adhesion layer.

A platinum-containing structure, comprising:

• a semiconductive substrate;
• a roughened platinum mass over the substrate, the roughened platinum mass having a continuous surface characterized by columnar pedestals having heights greater than or equal to about one-third of a total thickness of the roughened platinum mass;
• and
• a layer between the roughened platinum mass and the substrate, and against both the roughened platinum mass and the substrate;
• the layer comprising at least one of titanium nitride, iridium, rhodium, ruthenium, platinum, palladium, osmium, and silver.