Chemical treatment apparatus and chemical treatment method
AssigneeSony Corporation
InventorsHayato Iwamoto, Kiyoshi Kurosawa
Life of this patent
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Abstract
A chemical treatment apparatus including a treatment tank filled with chemical with which wafers are treated, and a jet pipe having chemical jetting holes which is provided at the bottom portion of the treatment tank and jets the chemical from the jetting holes thereof, the jetting holes containing at least first jetting holes for jetting the chemical upwardly and second jetting holes for jetting the chemical in a direction different from that of the first holes. The second direction is set to a direction within the range from the horizontal direction of the jet pipe to the obliquely downward direction at 45 degrees with respect to the horizontal direction.
Claims5
A chemical treatment method for filling chemical in a treatment tank and jetting the chemical from the lower side of wafers to be treated while the wafers are dipped in said treatment tank, thereby treating the wafers, characterized in that when the wafers are treated, the chemical is jetted at least two directions, one direction being set to the direction to the wafers and the other direction being set to a direction different from the direction to the wafers.
Dependencies are inferred from the claim text.