Semiconductor device and method for manufacturing the same
AssigneeNEC Corporation
InventorYoshifumi Moriyama
Life of this patent
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Abstract
In a semiconductor device including a semiconductor device chip mounted on a substrate and a solder bump electrode formed on an electrode film of the substrate, a pillar-form conductive paste is formed on a first surface portion of the electrode film, and a solder bump electrode is formed to cover the pillar-form conductive paste and a second surface portion of the electrode film on which the pillar-form conductive paste is not formed. With this arrangement, it is possible to realize a predetermined bump height, and also to prevent a bump from collapsing at the time of mounting.
Claims6
A method for manufacturing a semiconductor device, comprising the steps of:
- forming a pillar-form conductive paste on a first portion of an electrode by a printing method, and
- forming a solder bump to cover said pillar-form conductive paste and a second portion of the electrode on which said pillar-form conductive paste is not formed by printing a solder paste to cover said pillar form conductive paste and said second portion of the electrode on which said pillar-form conductive paste is not formed, and then reflow-melting the printed solder paste.
A method for manufacturing a semiconductor device, comprising the steps of:
- forming a pillar-form conductive paste on a first portion of an electrode by a printing method, and
- forming a solder bump to cover said pillar-form conductive paste and a second portion of the electrode on which said pillar-form conductive paste is not formed by a solder immersing method.
Dependencies are inferred from the claim text.