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US 6,281,051 B1Granted
Semiconductor device and manufacturing method thereof
AssigneeMitsubishi Denki Kabushiki Kaisha
InventorToshiaki Tsutsumi
Life of this patent
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Abstract
An object is to provide a structure of a semiconductor device which allows higher degree of integration both in vertical and horizontal directions, and to provide manufacturing method therefor. The semiconductor device includes source·drain electrodes connected to n− and n+ source·drain regions of an MISFET and has a function as a part of a bit line, and a gate electrode connected to a first interconnection as a word line. Electrodes are insulated from each other by a sidewall insulating film, silicon oxide film or a silicon nitride film provided inbetween. Since the word line and the bit line do not cross in the same plane, the difference in level in the vertical direction can be reduced.
Claims8
A method of manufacturing a semiconductor device, comprising the steps of:
- forming a first insulating film on a semiconductor substrate;
- forming a first opening in said first insulating film to expose a surface of said semiconductor substrate;
- forming first to third electrodes insulated from each other by a sidewall insulating film in said first opening;
- positioning an upper surface of any of said first to third electrodes different from upper surfaces of the other electrodes;
- forming an interconnection layer connected to the upper surface of any of said first to third electrodes;
- forming a second insulating film below said first electrode;
- forming impurity diffusion layers of a prescribed conductivity type in said semiconductor substrate below said second and third electrodes;
- after forming said first opening, forming said second insulating film on said semiconductor substrate;
- forming a first conductive film on said second insulating film only in said first opening;
- etching said first conductive film to form a first electrode and second and third openings to expose the surface of said semiconductor substrate;
- and
- forming a second conductive film only in said second and third openings.
9 more elements
A method of manufacturing a semiconductor device comprising the steps of:
- forming a first insulating film on a semiconductor substrate;
- forming a first opening in said first insulating film to expose a surface of said semiconductor substrate;
- forming first to third electrodes insulated from each other by a sidewall insulating film in said first opening;
- positioning an upper surface of any of said first to third electrodes different from upper surfaces of the other electrodes;
- forming an interconnection layer connected to the upper surface of any of said first to third electrodes;
- forming a second insulating film below said first electrode;
- forming impurity diffusion layers of a prescribed conductivity type in said semiconductor substrate below said second and third electrodes;
- positioning the upper surface of said first electrode higher than the upper surfaces of said second and third electrodes, and making approximately flush the upper surfaces of said second and third electrodes;
- after forming said first opening, forming a third insulating film only in said first opening;
- forming second and third openings to expose the surface of said semiconductor substrate at a prescribed region of said third insulating film;
- forming a first conductive film only in said second and third openings and forming the second and third electrodes;
- after forming said second and third electrodes, removing said third insulating film left in said first opening and forming a fourth opening;
- forming the sidewall insulating film on side surfaces of said second and third electrodes;
- and
- forming a second conductive film only in said fourth opening and forming the first electrode.
12 more elements
A method of manufacturing a semiconductor device comprising the step of:
- forming a first insulating film on a semiconductor substrate;
- forming a first opening in said first insulating film to expose a surface of said semiconductor substrate;
- forming first to third electrodes insulated from each other by a sidewall insulating film in said first opening;
- positioning an upper surface of any of said first to third electrodes different from upper surfaces of the other electrodes;
- forming an interconnection layer connected to the upper surface of any of said first to third electrodes;
- forming a second insulating film below said first electrode;
- forming impurity diffusion layers of a prescribed conductivity type in said semiconductor substrate below said second and third electrodes;
- and
- positioning the upper surface of said first electrode lower than upper surfaces of said second and third electrodes and making approximately flush the upper surfaces of said second and third electrodes.
6 more elements
A method of manufacturing a semiconductor device, comprising the steps of:
- forming a first insulating film on a semiconductor substrate;
- forming a first opening in said first insulating film to expose a surface of said semiconductor substrate;
- forming first to third electrodes insulated from each other by a sidewall insulating film in said first opening;
- positioning an upper surface of any of said first to third electrodes different from upper surfaces of the other electrodes;
- forming an interconnection layer connected to the upper surface of any of said first to third electrodes;
- forming a second insulating film below said first electrode;
- forming impurity diffusion layers of a prescribed conductivity type in said semiconductor substrate below said second and third electrodes;
- and
- positioning the upper surface of said first electrode between the upper surfaces of said second and third electrodes.
6 more elements
A method of manufacturing a semiconductor device, comprising the steps of:
- forming a first conductive film on a semiconductor substrate;
- removing said first conductive film, leaving a prescribed region, to form a stacked structure;
- forming a first insulating film on said semiconductor substrate filling a space around said stacked structure;
- removing a prescribed region of said stacked structure and forming first and second openings and a first electrode;
- forming second and third electrodes having sidewall insulating films in said first and second openings;
- positioning upper surface of any of said first to third electrodes at a position different from upper surfaces of the remaining electrodes;
- and
- forming an interconnection layer connected to an upper surface of any of said first to third electrodes.
5 more elements
Dependencies are inferred from the claim text.