Method of singulating a batch of integrated circuit package units constructed on a single matrix base

A method for singulating a combined batch of TFBGA package units constructed on a single TFBGA matrix substrate and enclosed in a continuous encapsulation body;

• the TFBGA matrix substrate being defined with a matrix of package sites delimited by a provisional bar of a certain width defining a singulation line for the singulation of the TFBGA package units;
• the method comprising the steps of:
• (1) performing a first cutting step, wherein a first cutting blade of a first width greater than the width of the provisional bar is used to cut into the TFBGA matrix substrate along the singulation line defined by the provisional bar, but not into the encapsulation body, until the provisional bar is substantially entirely cut away;
• and
• (2) performing a second cutting step, wherein a second cutting blade of a second width smaller than the first width is used to cut into the encapsulation body along the borderlines between the package sites so as to singulate the combined batch of TFBGA package unit into individual ones.

A method for singulating a combined batch of QFN package units constructed on a single QFN matrix leadframe and enclosed in a continuous encapsulation body;

• the QFN matrix leadframe being defined with a matrix of package sites delimited by a provisional bar of a certain width defining a singulation line for the singulation of the QFN package units;
• the method comprising the steps of:
• (1) performing a first cutting step, wherein a first cutting blade of a first width greater than the width of the provisional bar is used to cut into the QFN matrix leadframe along the singulation line defined by the provisional bar, but not into the encapsulation body, until the provisional bar is substantially entirely cut away;
• and
• (2) performing a second cutting step, wherein a second cutting blade of a second width smaller than the first width is used to cut into the encapsulation body along the borderlines between the package sites so as to singulate the combined batch of QFN package unit into individual ones.